Model
Digital Document
Publisher
Florida Atlantic University
Description
Pad Array Carrier (PAC) packaging is used for surface mounting of modules on printed circuit cards. The package described in this study has an added feature that allows for the testing of the package through the holes laid along the periphery of the package board. MAGIC was used in the design and layout of an 8 x 8 array size PAC. Two key contributors to electrical noise in the package, viz., cross talk and signal reflections were analyzed. Transmission line models were developed for analyzing these parameters. HSPICE and HP 85150B Microwave Design Systems (MDS) were used to simulate the transmission line models to evaluate the effects of cross talk and signal reflections on the package board. The performance of the package for the speed and maintenance of signal integrity was evaluated. Guidelines specifying the physical geometry limitations for line length, line width, line spacing, and layout configurations required to meet specific noise budget (cross talk and signal reflection considerations) were established.
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