Model
Digital Document
Publisher
Florida Atlantic University
Description
A survey of MOS RAM failure modes describes those failures
that a complete MOS RAM testing program accelerates and
identifies. Functional testers perform the identification
while burn-in testers accelerate various failure modes. A
dynamic burn-in system that includes temperature, bias, and
operational signal stress has been designed so that a large
number of MOS RAM modules are stressed during a burn-in
cycle. The system requires flexible hardware and software
configurations and an almost universal product interface.
Since these requirements have been met and the characteristics
of the stress signals are similar to those encountered
by the product during a normal lifetime, the dynamic
burn-in system presented in this study can effectively accelerate
the most prominent MOS RAM failure modes.
that a complete MOS RAM testing program accelerates and
identifies. Functional testers perform the identification
while burn-in testers accelerate various failure modes. A
dynamic burn-in system that includes temperature, bias, and
operational signal stress has been designed so that a large
number of MOS RAM modules are stressed during a burn-in
cycle. The system requires flexible hardware and software
configurations and an almost universal product interface.
Since these requirements have been met and the characteristics
of the stress signals are similar to those encountered
by the product during a normal lifetime, the dynamic
burn-in system presented in this study can effectively accelerate
the most prominent MOS RAM failure modes.
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